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after being discharged. Most popular of these batteries is the NiCd (nickel cadmium) and the lead acid batteries. The NiCd batteries have a cell voltage of 1.2 V the so-called 9-V box type , NiCd batteries are actually about 8.2 V The lead-acid batteries have a cell voltage of 2.0 V . . Lead-acid batteries of the so-called sealed variety are safe for use in portable instruments. Contrary to the lead-acid batteries used in cars, these do not pose any danger of leaking. Lead-acid batteries have higher energy density than NiCd. The lead-acid batteries also have a relatively larger retention compared to the NiCd batteries. Secondary batteries perform well if they are recharged regularly. If these batteries are discharged more than a certain minimum, their operational life reduces drastically. Batteries are charged at a fraction of their Ah rating. Typically, lead-acid batteries are charged at a tenth of the Ah rating of the battery. NiCd batteries, on the other hand, are quite quirky. NiCd batteries are recommended to be initially charged at a tenth of the Ah rating and then switched over to trickle charging at a fraction (1/50) of the Ah rating.

To realize this objective, the placement machine must identify the component in the turret or gantry and establish the position of the turret or gantry At the same time, the placement machine must know the position of the circuit board The computer software ties these two requirements together by being programmed with the artwork (drawings) that identify the location of each component on the circuit board Component recognition and circuit board recognition are discussed next, followed by comments regarding vision system limitations Component recognition is typically obtained from the configuration of the I/Os The I/O configuration includes two attributes: the I/O s shape, whether it is a beam lead, gull-wing.

FIGURE 40.22 Vision system images: (a) a flip chip component; (b) a printed circuit board fiducial. (Courtesy of Universal Instruments.)

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lead, or solder bump; and the I/O s layout, which may specify, for example, peripheral leads on two rather than four sides, or solder balls as full area-array packages rather than perimeter, area-array packages Shown in Fig 4022a is the machine vision image of a flip-chip die with a perimeter array of solder bumps The vision system determines the position of the package based upon the coordinates of the I/O locations, for example, two or four of the corner leads or solder bumps Additional fiducials and/or nonsymmetries in the I/O layout (eg, missing corner leads or bumps) are used to establish the rotational orientation of the component Besides determining component type and orientation, vision systems have also been programmed to recognize damage to components.

For example, fine-pitch quad flat packages are prone to bending of the very small leads, particularly at package corners, due to worn die sets or improper handling In the case of area-array packages (BGAs, CSPs, and DCA die), there can be missing balls or solder bumps The damaged component is rejected into the scrap bin and a new unit retrieved for placement It should be noted that component recognition vision systems are designed primarily for part placement Although defect recognition can be programmed into the software, increasing the degree of inspection function slows the placement process significantly Therefore, the optimum approach is to allow the vision system to identify only gross component defects, targeting those defects that would occur between incoming inspection and the component placement step Otherwise, full, incoming component inspection should be performed before the parts are loaded into the placement machine.

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Circuit board recognition requires that the machine (computer) be able to locate the circuit board site precisely for the component First, the circuit board is secured on the conveyor by mechanical clamps, vacuum chuck, or other technique The circuit board is then positioned under a camera that identifies the registration marks or fiducials on the surface (see Fig 4022b) This process is repeated for two to three other fiducials on the circuit board At this point, the machine knows the location and orientation of the circuit board and thus, through the artwork design stored in the software, correlates the fiducial locations with the location of each component site Subsequently, the software matches the coordinates of the circuit board site to those of the component positioned in the turret or gantry.

Then the software instructs the stepper motors to position the component over that site and lower it on to the circuit board Some applications, such as those using ceramic substrates that are prone to inconsistent degrees of shrinkage during fabrication (eg, low-temperature, co-fired ceramic, or LTCC), may develop a discrepancy between the software design and the actual circuit board component positions (pads) In this case, the placement site of each component is determined directly using fiducials in close proximity to that component site Although local fiducials may enhance component placement accuracy to some degree, especially when tolerance stack-up in the product causes it to deviate from the design files, this approach requires added processing time by the machine computer The result is a decrease in placement speed that can develop into an appreciable process delay, particularly for large production volumes..

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