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Checking Routed Results After all the connections have been routed into the signal layers, the actual shape and length of each wire is known, as is the layer(s) on which the wires have been routed and which nets are neighbors. This physical data can be loaded into the timing and transmission line analyzers to do a final check that all design goals have been met. Any violations that are detected can be repaired by hand rerouting as necessary. Once this set of checks has been completed and any adjustments made, the final routed result is checked against the schematic netlist to ensure that there are no discrepancies. A final check is performed on the Gerber data to ensure that the line width and spacing rules have been complied with and that there is no solder mask of silk screen on any pad, as well as that traces and other features that must be protected from solder are covered by solder mask.

Generating Manufacturing Files This step involves generating the photoplotting files, pick-and-place files, bare and loaded board test files, drawings, and bills of material needed to do the actual manufacturing. Typical lists of these files are shown in Tables 14.1 and 14.2.

(for e < 05)

Archiving Design Once all the manufacturing data has been created, the design database and all of the manufacturing data files are stored on a magnetic tape or other storage media for future use to incorporate changes and for backup in the event that the files and drawings created for manufacturing are lost or destroyed.

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TABLE 14.1 A Typical Collection of Design Files Sent to a PCB Fabricator File name BBBBpCCC.arc* applist.p ly1 thru lyx.ger topmsk.ger botmsk.ger topslk.ger botslk.ger pc_356.out name0.rep name0.prf name1.rep XX.XX.fab File contents Arc file of Gerber files containing: List of photoplot apertures for artwork Gerber photoplot data for x PCB layers Gerber photoplot data for top solder mask Gerber photoplot data for bottom solder mask Gerber photoplot data for top silk screen Gerber photoplot data for bottom silk screen IPC 356 data for blank PCB netlist testing Drill allocation report for plated holes Excellon drill file for all plated holes Drill allocation report for all nonplated holes Fabrication drawing in HPGL format, sheet XX of XX

403333 Machine Vision Technology A brief which is description is provided of one of the most critical advancements in component placement machine vision technology The earliest pick-and-place function relied on mechanical stops (detents), switches and precision tooling to ensure that components were placed at the correct locations and with the proper alignment of I/Os to pads As both board densities and component varieties increased, this technology was too slow to meet the requirements for higher production volumes and reduced placement defects A critical incentive to move away from mechanical registration toward vision-based placement came from smaller I/Os on components DCA/FC uses die bump pitches as small as 01 mm Passive device sizes are commonly 0402 and 0201 Finepitch, quad flat pack (QFP) components have lead pitches as small as 03 mm.

Each of these cases underscores the need for very high placement precision that can be realized only with machine vision technology In addition, there has been a steady increase of odd-shaped devices that include inductors as well as LEDs, surface-mount connectors, etcThe result has been circuit boards with a greater mix of package types and sizes Consequently, it is considerably less expensive and time-consuming to reprogram a computer-based, machine vision system to recognize these components than it is to retool a machine based on mechanical relays, detents, and such for component placement Machine vision technology uses electronic cameras and optics together with specialized computer software to control the stepper motors responsible for positioning the component and the circuit board (site) relative to each other with the required accuracy and precision.

For most applications, the friction power loss in an aerostatic bearing may be simply ignored as the value is very low However, in applications where the friction power loss must be considered, the power dissipated as heat due to the friction in any full journal bearing is calculated as P =

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